| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MT53D512M32D2DS-053 WT:D | MICRON/美光 | BGA | 24+ | 346 | 2026-01-19 | |||
| K4B4G1646E-BCNB | SAMSUNG/三星 | BGA | 24+ | 103040 | 2026-01-19 | |||
| K4A4G165WF-BCTD | SAMSUNG/三星 | BGA | 24+ | 89600 | 2026-01-19 | |||
| MT53D1024M32D4DT-046 WT:D | MICRON/美光 | BGA | 24+ | 9520 | 2026-01-19 | |||
| H5ANAG6NCJR-XNC | SKHYNIX/海力士 | BGA | 22 | 10000 | 2026-01-19 | |||
| H5GC8H24AJR-R2C | SKHYNIX/海力士 | BGA | 24+ | 11410 | 2026-01-19 | |||
| K4B4G1646E-BYMA | SAMSUNG/三星 | BGA | 24+ | 103040 | 2026-01-19 | |||
| KLMDG4UCTB-B041 | SAMSUNG/三星 | BGA | 25 | 25971 | 2026-01-19 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| KLM8G1GEUF-B04P | SAMSUNG/三星 | BGA | 25 | 25971 | 2026-01-19 | |||
| KLMCG2UCTB-B041 | SAMSUNG/三星 | BGA | 25 | 25971 | 2026-01-19 | |||
| K3UH7H70AM-JGCL | SAMSUNG/三星 | BGA | 25 | 25971 | 2026-01-19 | |||
| K4U6E3S4AA-MGCR | SAMSUNG/三星 | BGA | 25 | 25971 | 2026-01-19 | |||
| K4FBE3D4HM-MGCJ | SAMSUNG/三星 | BGA | 25 | 25971 | 2026-01-19 | |||
| H5ANAG6NCMR-VKC | SAMSUNG/三星 | BGA | 25 | 25971 | 2026-01-19 | |||
| K4A8G165WB-BCRC | SAMSUNG/三星 | BGA | 25 | 25971 | 2026-01-19 | |||
| H9HCNNNBKMMLHR-NME | SKHYNIX/海力士 | BGA | 24+ | 2000 | 2026-01-19 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| H5AN4G6NBJR-VKC | SKHYNIX/海力士 | BGA | 24+ | 32001 | 2026-01-19 | |||
| H5AN4G6NBJR-VKC | SKHYNIX/海力士 | BGA | 25+ | 10000 | 2026-01-08 | |||
| H5TC2G83GFR-PBA | SKHYNIX/海力士 | BGA | 25+ | 10000 | 2026-01-08 | |||
| RF3023 | RFMD/威讯 | 19+ | 3500 | 2025-10-08 | ||||
| XDL15-2-020S |
|
ANAREN/安伦 | 2024 | 5000 | 2025-10-08 | |||
| RD01MUS2B |
|
MITSUBISHI/三菱 | 20+ | 50000 | 2025-10-08 | |||
| SC1894A-00C13 |
|
MAXIM/美信 | 2024 | 5000 | 2025-10-08 | |||
| SC1894A-00C13E |
|
MAXIM/美信 | 19+ | 3500 | 2025-10-08 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| K4B4G1646E-BYMA | SAMSUNG/三星 | BGA | 24+ | 103040 | 2026-01-19 | |||
| MT53D512M32D2DS-053 WT:D | MICRON/美光 | BGA | 24+ | 346 | 2026-01-19 | |||
| K4B4G1646E-BCNB | SAMSUNG/三星 | BGA | 24+ | 103040 | 2026-01-19 | |||
| MT53D1024M32D4DT-046 WT:D | MICRON/美光 | BGA | 24+ | 9520 | 2026-01-19 | |||
| K4A4G165WF-BCTD | SAMSUNG/三星 | BGA | 24+ | 89600 | 2026-01-19 | |||
| K4AAG165WA-BCWE | SAMSUNG/三星 | BGA | 25 | 25971 | 2026-01-19 | |||
| K4UCE3Q4AB-MGCL | SAMSUNG/三星 | BGA | 25 | 25971 | 2026-01-19 | |||
| K4B2G1646F-BYMA | SAMSUNG/三星 | BGA | 25+ | 10000 | 2026-01-08 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| RA30H1317M1-501 |
|
MITSUBISHI/三菱 | H2M | 19+ | 5000 | 2025-10-08 | ||
| RA30H4452M1 |
|
MITSUBISHI/三菱 | H2M | 19+ | 60000 | 2025-10-08 | ||
| RF3023SR | RFMD/威讯 | 19+ | 10000 | 2025-10-08 | ||||
| RA30H1317M1 |
|
MITSUBISHI/三菱 | H2M | 19+ | 10000 | 2025-10-08 | ||
| RD01MUS2B-T113 | MITSUBISHI/三菱 | SOT89 | 19+ | 10000 | 2025-10-08 | |||
| AFT05MS031NR1 |
|
NXP/恩智浦 | TO-270-2 | 20+ | 5000 | 2025-10-08 | ||
| RD07MVS1B |
|
MITSUBISHI/三菱 | QFN | 16+ | 1513 | 2025-10-08 | ||
| RD70HVF1 |
|
MITSUBISHI/三菱 | DIP | 19+ | 10000 | 2025-10-08 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| H5ANAG6NCJR-XNC | SKHYNIX/海力士 | BGA | 22 | 10000 | 2026-01-19 | |||
| H5GC8H24AJR-R2C | SKHYNIX/海力士 | BGA | 24+ | 11410 | 2026-01-19 | |||
| K4A4G165WE-BCTD | SAMSUNG/三星 | BGA | 25 | 25971 | 2026-01-19 | |||
| K4AAG165WA-BITD | SAMSUNG/三星 | BGA | 25 | 25971 | 2026-01-19 | |||
| K4F8E304HB-MGCJ | SAMSUNG/三星 | BGA | 25 | 25971 | 2026-01-19 | |||
| K4FBE3D4HM-TFCL | SAMSUNG/三星 | BGA | 25 | 25971 | 2026-01-19 | |||
| H5ANAG6NCJR-XNC | SKHYNIX/海力士 | BGA | 25+ | 10000 | 2026-01-08 | |||
| H9HCNNNCPMMLXR-NEE | SKHYNIX/海力士 | BGA | 25+ | 10000 | 2026-01-08 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| KLMDG4UCTB-B041 | SAMSUNG/三星 | BGA | 25 | 25971 | 2026-01-19 | |||
| KLM8G1GETF-B041006 | SAMSUNG/三星 | BGA | 25+ | 10000 | 2026-01-08 | |||
| KMDX60018M-B425 | SAMSUNG/三星 | BGA | 22 | 50005 | 2025-10-08 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| BCM6123TD1E2663T00 | VICOR | 24 | 300 | 2025-10-27 | ||||
| DCM3623T36G06A8T00 | VICOR | 24 | 162 | 2025-10-27 | ||||
| BCM6123TD1E5135T0R | VICOR | 24 | 59 | 2025-10-08 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| KLMCG4JEUD-B04Q | SAMSUNG/三星 | BGA | 22 | 4000 | 2026-03-02 | |||
| BWEFMD008GN8RC | BIWIN/佰维 | BGA 153ball | 25+ | 10000 | 2026-03-02 | |||
| CXDQ3A8AM-CJ-A | CXMT/长鑫 | 23+ | 100000 | 2026-01-28 | ||||
| K4A4G165WG-BCW | SAMSUNG/三星 | 25 | 10000 | 2025-12-29 | ||||
| RS70B08G3S03F | RAYSON/晶存 | FBGA153 | 25 | 10000 | 2025-12-16 | |||
| K4VAF325ZC-SC28 | SAMSUNG/三星 | 25 | 8960 | 2025-11-24 | ||||
| KLM8G1GEUF-B04Q | SAMSUNG/三星 | 25 | 20000 | 2025-11-14 | ||||
| NT5AD1024M8A3-HR | NANYA/南亚 | BGA78 | 25 | 100000 | 2025-10-29 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| KLMCG4JEUD-B04Q | SAMSUNG/三星 | BGA | 22 | 4000 | 2026-03-02 | |||
| RS70B08G3S03F | RAYSON/晶存 | FBGA153 | 25 | 10000 | 2025-12-16 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PI3741-01-LGIZ | VICOR | 24 | 1000 | 2025-10-08 | ||||
| PI3523-00-LGIZ | VICOR | 24 | 1000 | 2025-10-08 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PI3546-00-LGIZ | VICOR | 24 | 800 | 2025-10-08 | ||||
| PI3545-00-LGIZ | VICOR | 24 | 1400 | 2025-10-08 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| AFT09MS007NT1 |
|
NXP/恩智浦 | 20 | 10000 | 2025-10-08 |